Trouble Controlling Reflow Oven Temperature During Production? This Setting Standard Will Help
In the SMT (Surface Mount Technology) production process, the accuracy of reflow oven temperature control directly determines the welding quality and electronic product performance. Even slight deviations can lead to defects such as cold solder joints, voids, or component damage.
RICH FULL JOY Electronics, based on extensive PCBA manufacturing experience and technical expertise, has developed the “Reflow Oven Temperature Profile Setting Standard,” providing a scientific, systematic, and practical guideline for SMT reflow oven temperature control.
Standard Overview
This standard applies to all reflow ovens in our SMT workshop, with professional SMT engineers responsible for setting and managing temperature profiles to ensure accurate temperature control during welding.
Tools Preparation
To accurately measure and set temperature profiles, the following tools are required: PROFILE tester, thermocouple wires, real PCB boards for measurement, protective gloves, and solder paste specifications.
Setting Standards
1. Reference Basis – Set parameters like ramp-up rate, preheat temperature, and reflow temperature based on the characteristics of different solder pastes (e.g., lead-free, leaded solder pastes).
2. Measurement Basis – Temperature profiles must be measured on real PCB boards to accurately reflect the effects of actual production environments on heat transfer.
3. General Standards
·Ramp-up Rate: 1–4℃/s
·Preheat Zone: 150–200℃, 60–120s
·Reflow Zone: ≥220℃ for 30–60s
·Peak Temperature: 235–250℃
·Cooling Rate: <3℃/s
4. Special Requirements – Adjust the profile dynamically based on product quality feedback or strictly follow customized customer requirements.
5. I-Glue Curing Parameters – I-glue curing temperature is 120℃, with curing time between 90–150 seconds, and a maximum limit of 170℃.
Precautions
1. Daily Testing – A full temperature profile test must be performed and recorded after power-on or production line changeover daily.
2. Operation Authority – Only professional SMT engineers are authorized to modify temperature profile settings.
3. Customer Specification Compliance – Strictly set process parameters according to customer-specified reflow requirements.
4. Equipment Maintenance – Conduct airflow tests for the reflow oven’s exhaust system every six months, ensuring stable operation. Temperature differences between zones must not exceed 70℃.
Conclusion
By implementing the “Reflow Oven Temperature Profile Setting Standard,” RICH FULL JOY Electronics ensures high-quality SMT welding, improves production reliability and product performance, and helps customers accelerate time-to-market and gain competitive advantages.
Media ContactCompany Name: Shenzhen Rich Full Joy Electronics Co., Ltd.Email: Send EmailCountry: ChinaWebsite: https://www.richpcba.com/
